The equipment is Sputtering machine, which forms the first thin film on the substrate with enhanced adhesion, and by using thermal evaporation, depose fluorine chemical compound on the substrate, having anti-finger print characteristics.

• Uniform thin film and maximize production by using rotative and orbital jig.
• Cost wise (A/F materials), compared to spray method and high production compared to E/Beam method(4~6 times)
• Capa. : 432EA/Batch in size of 7 inch
• Process Time : 40min